| 產(chǎn)品中心 >> Power Device Industry >> b Used for potting with insulation of power heating electronic components |
| 6100A-41BD/116B-3 or 116 B-7 or 116 B-9 |
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| 產(chǎn) 品 類 別 |
| Thermal conductivity Epoxy Resin Compounds for Potting
|
|
| 產(chǎn) 品 特 點(diǎn) |
| Excellent electrical property, Environmental product, high thermal conductivity
|
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| 應(yīng) 用 范 圍 |
| Used for potting and insulation of power heating electronic components
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|
| 產(chǎn) 品 性 能 |
6100A-41BD/116B-3 or 116 B-7 or 116 B-9
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Properties
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Test Conditions
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Unit
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Index
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|
Component A
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-
|
-
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6100A-41BD
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Component B
|
-
|
-
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116B-3,116B-7
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116B-9
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|
Component A viscosity
|
40℃
|
mPa·s
|
≤20000
|
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Component B viscosity
|
40℃
|
mPa·s
|
5～20
|
|
Component A specific gravity
|
25℃
|
g/cm3
|
2.45±0.03
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Component B specific gravity
|
25℃
|
g/cm3
|
0.98±0.03
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|
Proportion(A/B)
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by weight
|
-
|
100
: 8-10
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100
: 10-12.5
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Curing conditions
|
-
|
-
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25℃/24-48h or 80℃/2-3h
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25℃/16h or 80℃/1.5h
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Hardness
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25℃
|
|
≥85
|
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Inflecting strength
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Normal
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MPa
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≥80
|
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Glass transition temperature
|
DSC，10℃/min
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℃
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45～60
|
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Water absorption
|
100℃/30min
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%
|
≤0.2
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Thermal conductivity
|
Plate heat flow method
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W/m·K
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≥1.0
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≥0.9
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Volume resistance
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Normal
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Ω·m
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≥1.0×1012
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Dielectric constant
|
1MHz，25℃
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|
4.5±0.3
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Dissipation factor
|
1MHz，25℃
|
%
|
≤1.6
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Electric strength
|
Normal
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MV/m
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≥20.0
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| 點(diǎn)擊數(shù)：244 錄入時(shí)間：2020/7/11 【打印此頁】 【關(guān)閉】 |
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