| 產(chǎn)品中心 >> Power Device Industry >> b Used for potting with insulation of power heating electronic components |
| 6100A-8FT / 116B-3 or 117B-3 |
|
| 產(chǎn) 品 類 別 |
| Thermal conductivity Epoxy Resin Compounds for Potting
|
|
| 產(chǎn) 品 特 點 |
| Excellent electrical property, high thermal conductivity, Environmental product
|
|
| 應 用 范 圍 |
| Filling insulation or encapsulation insulation protection for power heating electronic components
|
|
| 產(chǎn) 品 性 能 |
6100A-8FT / 116B-3
or 117B-3
|
Properties
|
Test Conditions
|
Unit
|
Index
|
|
Component A
|
-
|
-
|
6100A-8FT
|
|
Component B
|
-
|
-
|
116B-3
|
117B-3
|
|
Component A viscosity
|
25℃
|
Pa·s
|
200-400
|
|
Component B viscosity
|
40℃
|
mPa·s
|
5～15
|
10～30
|
|
Component A specific gravity
|
25℃
|
g/cm3
|
2.58±0.05
|
|
Component B specific gravity
|
25℃
|
g/cm3
|
0.97±0.03
|
0.98±0.03
|
|
Proportion(A/B)
|
by weight
|
-
|
100
/ 7 ± 0.2
|
100
/ 5.0 - 5.5
|
|
Curing
conditions
|
-
|
-
|
25℃/24h① 或100℃/1h(②or 25℃/2h + 100℃/1h
|
|
Hardness
|
25℃
|
Shore
D
|
≥92
|
≥90
|
|
Tensile
strength
|
25℃
|
MPa
|
≥75
|
≥80
|
|
Compression
strength
|
25℃
|
MPa
|
≥120
|
≥120
|
|
Glass transition temperature①
|
DSC，10℃/Min
|
℃
|
45～60
|
≥70
|
|
Glass transition temperature②
|
DSC，10℃/Min
|
℃
|
≥50
|
≥120
|
|
Coefficient of thermal
expansion a1
|
TMA，10℃/Min
|
ppm/℃
|
26-36
|
25-35
|
|
Coefficient of thermal
expansion a2
|
TMA，10℃/Min
|
ppm/℃
|
80-120
|
80-110
|
|
Water absorption
|
25℃/24h
|
%
|
≤0.2
|
|
Volume resistance
|
Normal
|
Ω·m
|
≥1.0×1013
|
≥1.0×1012
|
|
Dielectric constant
|
1MHz，25℃
|
|
5.0±0.3
|
4.8±0.3
|
|
Dissipation factor
|
1MHz，25℃
|
%
|
≤0.04
|
≤0.03
|
|
Electric strength
|
Normal
|
MV/m
|
≥18.0
|
|
Thermal conductivity
|
Normal
|
W/（m·K）
|
≥1.1
|
≥1.2
|
|
|
|
| 點擊數(shù)：335 錄入時間：2020/7/11 【打印此頁】 【關(guān)閉】 |
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