| 產(chǎn)品中心 >> Power Device Industry >> c Used for potting with insulation of bridge ballast, rectifier diode or other heating electronic components |
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| 產(chǎn) 品 類 別 |
| Epoxy Resin Compounds for Potting
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| 產(chǎn) 品 特 點(diǎn) |
| Excellent electrical property, Environmental product,low CTE, low curing shrinkage, low stress
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| 應(yīng) 用 范 圍 |
| Used for potting and insulation of bridge ballast, rectifier diode or other heating electronic components
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| 產(chǎn) 品 性 能 |
6100A/B-8BG
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Properties
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Test Conditions
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Unit
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Index
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Component A
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-
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-
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6100A-8BG
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Component B
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-
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-
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6100B-8BG
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Component A viscosity
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40℃
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mPa·s
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≤100，000
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Component B viscosity
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40℃
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mPa·s
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15～30
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Component A specific gravity
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25℃
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g/cm3
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1.77±0.05
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Component B specific gravity
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25℃
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g/cm3
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1.19±0.05
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Proportion(A/B)
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by weight
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-
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100：24-25
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Curing
conditions
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-
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-
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80℃/2h +100℃/2h+140℃/2h
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Glass transition temperature
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DSC
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℃
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≥120
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Volume resistance
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Normal
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Ω·m
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≥1.0×1013
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Dielectric constant
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1MHz
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4.6±0.3
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Dissipation factor
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1MHz
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%
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≤1.5
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Electric strength
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Normal
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MV/m
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≥20
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Inflecting
strength
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Normal
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MPa
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≥75
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Hardness(Shore D)
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Normal
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≥90
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Coefficient of thermal
expansion a1
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TMA
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1/℃
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≤3.5×10-5
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Coefficient of thermal
expansion a2
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TMA
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1/℃
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≤13.0×10-5
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Thermal conductivity
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Normal
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W/m·k
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≥O.4
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