產(chǎn)品中心 >> Power Device Industry >> b Used for potting with insulation of power heating electronic components |
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產(chǎn) 品 類 別 |
Flame retardant Epoxy Resin Compounds for Potting
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產(chǎn) 品 特 點 |
High Tg, flame retardant, high thermal conductivity, low stress
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應(yīng) 用 范 圍 |
Used for potting and insulation of power heating electronic components
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產(chǎn) 品 性 能 |
5201A/B-88
Properties
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Test Conditions
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Unit
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Index
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Component A
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-
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-
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5201A-88
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Component B
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-
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-
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5201B-88
5201B-3
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Component A viscosity
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40℃
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mPa·s
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10000-20000
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Component B viscosity
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40℃
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mPa·s
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1000~2000
18-25
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Component A specific gravity
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25℃
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g/cm3
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1.79±0.03
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Component B specific gravity
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25℃
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g/cm3
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1.79±0.03
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Proportion(A/B)
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by weight
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-
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100:100±3
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Curing
conditions
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-
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-
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125℃/3h or ② 100℃/2h + 150℃/2h
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Glass transition temperature
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DSC,10℃/min
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℃
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≥120 ①,≥130 ②
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Coefficient of thermal
expansion a1
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TMA,10℃/min
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1/K
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3.0-3.5×10-5
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Coefficient of thermal
expansion a2
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TMA,10℃/min
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1/K
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10.0-13.0×10-5
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Volume resistance
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25℃
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Ω·m
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≥1.0×1013
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Dielectric constant
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1MHz
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4.5±0.3
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Dissipation factor
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1MHz
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%
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≤1.5
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Electric strength
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Normal
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MV/m
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≥20.0
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Inflecting strength
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25℃
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MPa
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≥60
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Inflecting
modulus
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25℃
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MPa
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10000-14000
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Hardness
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(Shore
D)
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-
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≥88
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Water absorption
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100℃/1h
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%
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≤0.15
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Thermal conductivity
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Hot-wire
technique
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W/m.K
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≥0.85
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Flammation Preventable
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UL
94(6mm)
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-
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V-0
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