| 產(chǎn)品中心 >> Power Device Industry >> b Used for potting with insulation of power heating electronic components |
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| 產(chǎn) 品 類 別 |
| Flame retardant Epoxy Resin Compounds for Potting
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| 產(chǎn) 品 特 點(diǎn) |
| High Tg, flame retardant, low thermal expansion coefficient and stress
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| 應(yīng) 用 范 圍 |
| Used for potting and insulation of power heating electronic components
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| 產(chǎn) 品 性 能 |
5201A/B-61BD
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Properties
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Test Conditions
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Unit
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Index
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Component A
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-
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-
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5201A-61BD
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Component B
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-
|
-
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5201B-61BD
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Component A viscosity
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40℃
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mPa·s
|
3000-6000
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Component B viscosity
|
40℃
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mPa·s
|
600～1800
18-25
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Component A specific gravity
|
25℃
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g/cm3
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1.79±0.03
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Component B specific gravity
|
25℃
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g/cm3
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1.81±0.03
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Proportion(A/B)
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by weight
|
-
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100：100±3
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Curing
conditions
|
-
|
-
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125℃/4h or ② 100℃/1h + 125℃/3h
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Glass transition temperature
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DSC，10℃/min
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℃
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≥120 ①,≥130 ②
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Coefficient of thermal
expansion a1
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TMA，10℃/min
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1/K
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2.3-2.9×10-5
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Coefficient of thermal
expansion a2
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TMA，10℃/min
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1/K
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6.5-9.5×10-5
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Volume resistance
|
25℃
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Ω·m
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≥1.0×1013
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Dielectric constant
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1MHz
|
-
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4.5±0.3
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Dissipation factor
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1MHz
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%
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≤1.8
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Electric strength
|
-
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MV/m
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≥20.0
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Inflecting strength
|
25℃
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MPa
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≥60
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Inflecting modulus
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25℃
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MPa
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10000-14000
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Hardness
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(Shore
D)
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-
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≥90
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Water absorption
|
100℃/1h
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%
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≤0.15
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Cure shrinkage rate
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Solid-liquid density ratio
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%
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≤2.0
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Flammation Preventable
|
UL
94（6mm）
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-
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V-0
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