| |
當(dāng)前位置：首 頁(yè) > 產(chǎn)品中心 |
|
| 產(chǎn)品中心 >> Optoelectronic industry >> d Packaging of optoelectronic components such as light-emitting diodes, especially white with blue LED |
|
| 產(chǎn) 品 類(lèi) 別 |
| Epoxy encapsulation material for White LED lamps
|
|
| 產(chǎn) 品 特 點(diǎn) |
| Environmental product, halogen free, moderate viscosity, low light decay, high Tg, good transmittance, heat resistance, UV aging resistance
|
|
| 應(yīng) 用 范 圍 |
| Packaging of optoelectronic components such as light-emitting diodes, especially white and blue LED
|
|
| 產(chǎn) 品 性 能 |
8100A/B-014
|
Properties
|
Test Conditions
|
Unit
|
Index
|
|
Component A
|
-
|
-
|
8100A-014
|
|
Component B
|
-
|
-
|
8100B-014
|
|
Component A viscosity
|
40℃
|
mPa·s
|
100～200
|
|
Component B viscosity
|
40℃
|
mPa·s
|
350～900
|
|
Component A specific gravity
|
25℃
|
g/cm3
|
1.15 ± 0.03
|
|
Component B specific gravity
|
25℃
|
g/cm3
|
1.19 ± 0.03
|
|
Proportion(A/B)
|
by weight
|
-
|
100：100
|
|
Curing
conditions
|
-
|
-
|
≥150℃/50min demold + 150℃/3～4h postcure
|
|
Hardness
|
25℃,Shore D
|
-
|
87 ± 3
|
|
Glass transition temperature
|
TMA，10℃/min
|
℃
|
≥130
|
|
Coefficient of thermal expansion a1
|
TMA，10℃/min（≤Tg）
|
m/m/℃
|
7.0 ± 0.5×10-5
|
|
Coefficient of thermal expansion a2
|
TMA，10℃/min（≥Tg）
|
m/m/℃
|
18.5 ± 2.0×10-5
|
|
Refractive
index
|
25℃
|
-
|
1.52 ± 0.03
|
|
Transparency
|
25℃，1mm
|
%
|
≥95
|
|
|
|
| 點(diǎn)擊數(shù)：376 錄入時(shí)間：2020/7/11 【打印此頁(yè)】 【關(guān)閉】 |
|
|
|
蘇公網(wǎng)安備 32021402001754號(hào)