| 產(chǎn)品中心 >> Adhesive industry >> c Hollow package of components used in electronics with electrical industry |
| 7101-09T |
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| 產(chǎn) 品 類 別 |
| One-component epoxy adhesive
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| 產(chǎn) 品 特 點(diǎn) |
| Fast curing speed, easy operation, good toughness , good resistance to humidity and heat,low CTE
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| 應(yīng) 用 范 圍 |
| Hollow package of components used in electronics and electrical industry
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| 產(chǎn) 品 性 能 |
7101-09 T
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Properties
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Test
Conditions
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Unit
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Index
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Specific
gravity
|
25℃
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mPa·s
|
150000-250000
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Viscosity
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25℃
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g/cm3
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1.56±0.05
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Curing
conditions
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-
|
-
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Procuringprecure：80℃/100min
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Post
curing：80℃/60min+150℃/120min
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Volume
resistance
|
-
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Ω·m
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≥1.0×1013
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Electric
strength
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-
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MV/m
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≥20
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Dielectric
constant
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25℃，1MHz
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-
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4.0～4.5
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Hardness
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25℃，Shore
D
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-
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80～90
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Coefficient
of thermal expansion a1
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TMA,10℃/min
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ppm/℃
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＜60
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Glass
transition temperature
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TMA,10℃/min
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℃
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80～100
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