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| 產(chǎn)品中心 >> Adhesive industry >> d Used for sealing or bonding of motor rotors or magnetic materials, coils, etc. used īn electronics αnd electrical industries |
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| 產(chǎn) 品 類 別 |
| One-component epoxy adhesive
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| 產(chǎn) 品 特 點 |
| Low curing temperature, fast curing speed,easy operation,high thixotropy, the glue spot does not deform after curing, excellent electrical property, the temperature resistance is high, the bonding strength is high
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| 應(yīng) 用 范 圍 |
| Used for sealing or bonding of motor rotors or magnetic materials, coils, etc. used in electronics and electrical industries
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| 產(chǎn) 品 性 能 |
7101-098 W
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Properties
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Test
Conditions
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Unit
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Index
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Specific
gravity
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25℃
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g/cm3
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1.45±0.05
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Length
of sagging
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120℃/45º
0.1g
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mm
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≤2
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Curing
conditions
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-
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-
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120℃/60min
or 135℃/30min
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Hardness
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25℃
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Shore
D
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≥85
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Glass
transition temperature
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DSC，10℃/Min
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℃
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≥110
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Shear
adhesive strength
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Al-Al
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MPa
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≥12.0
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Volume
resistance
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Normal
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Ω·m
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≥1.0×1013
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Electric
strength
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1MHz，25℃
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-
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≥20
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Dielectric
constant
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Normal
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MV/m
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4.5～5.1
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| 點擊數(shù)：209 錄入時間：2020/7/11 【打印此頁】 【關(guān)閉】 |
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