產(chǎn)品中心 >> Adhesive industry >> f Used for bonding with fixing of metal, magnetic core with plastic used in electronics with electrical industry |
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產(chǎn) 品 類 別 |
One-component epoxy adhesive
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產(chǎn) 品 特 點(diǎn) |
Fast curing speed, easy operation, low CTE, excellent electrical property, good resistance to acid and alkali, high bonding strength
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應(yīng) 用 范 圍 |
Used for potting and bonding of metal, magnetic core and plastic used in electronics and electrical industry
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產(chǎn) 品 性 能 |
7101-73 W
Properties
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Test
Conditions
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Unit
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Index
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Specific
gravity
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25℃
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g/cm3
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1.62-1.72
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Viscosity
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25℃
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Pa·s
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500~1000
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Curing
conditions
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-
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-
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120℃/60min
or 100℃/90min
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Hardness
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25℃
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Shore
D
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≥85
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Shear
adhesive strength
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Al-Al
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MPa
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≥10.0
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Glass
transition temperature
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DSC,10℃/min
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℃
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≥120
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Coefficient
of thermal expansion a1
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TMA,10℃/min
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ppm
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α1≤40
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Volume
resistance
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Normal
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Ω·m
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≥1.0×1013
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Electric
strength
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Normal
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MV/m
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≥20
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Dielectric
constant
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1MHz,25℃
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-
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4.0~4.5
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