| 產(chǎn)品中心 >> Adhesive industry >> i Used for bonding with fixing of small electronic components |
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| 產(chǎn) 品 類 別 |
| Quick drying epoxy adhesive at room temperature
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| 產(chǎn) 品 特 點 |
| High thixotropy, fast curing speed, excellent electrical property
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| 應 用 范 圍 |
| Used for bonding and fixing of small electronic components
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| 產(chǎn) 品 性 能 |
9100A/B-03
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Properties
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Test
Conditions
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Unit
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Index
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Component
A
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-
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-
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9100A-051
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Component B
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-
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-
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9100B-051
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Component A viscosity
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25℃
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mPa·s
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100000-200000
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Component B viscosity
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25℃
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mPa·s
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20000-50000
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Proportion(A/B)
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by
weight
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-
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100：50
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Curing conditions
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-
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-
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25℃/24h or 60℃/3h
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Shear
adhesive strength
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Al-Al
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MPa
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≥15
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Hardness
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（Shore
D）
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-
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≥80
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Glass
transition temperature
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DSC,10℃/min
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℃
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≥40
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Tensile
strength
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-
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MPa
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≥40
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