| 產(chǎn)品中心 >> Adhesive industry >> k Used for bonding of small electronic components with wires |
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| 產(chǎn) 品 類 別 |
| Epoxy adhesive at room temperature adhesive
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| 產(chǎn) 品 特 點 |
| Fast curing speed, excellent electrical property, high bonding strength
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| 應 用 范 圍 |
| Used for bonding of small electronic components and wires
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| 產(chǎn) 品 性 能 |
9100A/B-052
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Properties
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Test
Conditions
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Unit
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Index
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Component
A
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-
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-
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9100A-052
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Component
B
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-
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-
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9100B-052
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Component
A viscosity
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25℃
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mPa·s
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8000-16000
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Component
B viscosity
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25℃
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mPa·s
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10000-30000
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Proportion(A/B)
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by
weight
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-
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100：100
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Curing
conditions
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-
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-
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Normal
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Shear
adhesive strength
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Al-Al
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MPa
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≥3
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Hardness
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25℃
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Shore
D
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≥70
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Glass
transition temperature
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DSC,10℃/min
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℃
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≥40
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| 點擊數(shù)：327 錄入時間：2020/7/11 【打印此頁】 【關(guān)閉】 |
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