| 產(chǎn)品中心 >> Adhesive industry >> i Used for bonding with fixing of small electronic components |
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| 產(chǎn) 品 類(lèi) 別 |
| Quick drying epoxy adhesive at room temperature
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| 產(chǎn) 品 特 點(diǎn) |
| Fast curing speed, moderate viscosity, high thixotropy, excellent electrical property, good toughness, high bonding strength
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| 應(yīng) 用 范 圍 |
| Used for bonding and fixing of small electronic components
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| 產(chǎn) 品 性 能 |
9100A/B-033G
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Properties
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Test
Conditions
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Unit
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Index
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Component
A
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-
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-
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9100A-033G
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Component
B
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-
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-
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9100B-033G
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Component
A viscosity
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25℃
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mPa·s
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30000-60000
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Component
B viscosity
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25℃
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mPa·s
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20000-40000
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Component
A specific gravity
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25℃
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g/cm3
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1.10-1.16
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Component
B specific gravity
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25℃
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g/cm3
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1.14-1.20
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Proportion(A/B)
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By
volume
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-
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100：100±2
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Curing
conditions
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-
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-
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25℃/6-8h
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Shear
adhesive strength
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Al-Al
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MPa
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≥10
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Hardness
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（Shore
D）
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45-60
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Glass
transition temperature
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DSC,10℃/min
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℃
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10-20
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Volume
resistance
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-
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Ω.m
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≥1×1012
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Electric
strength
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-
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MV/m
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≥20.0
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Dielectric
constant
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1MHz
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-
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4.6-5.2
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Dissipation
factor
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1MHz
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%
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≤1.8
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