| 產(chǎn)品中心 >> Adhesive industry >> i Used for bonding with fixing of small electronic components |
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| 產(chǎn) 品 類 別 |
| Epoxy adhesive at room temperature
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| 產(chǎn) 品 特 點 |
| Fast curing speed, high thixotropy, excellent electrical property, high bonding strength
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| 應(yīng) 用 范 圍 |
| Used for bonding and fixing of small electronic components
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| 產(chǎn) 品 性 能 |
9100A/B-030EG
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Properties
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Test
Conditions
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Unit
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Index
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Component
A
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-
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-
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9100A-030EG
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Component
B
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-
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-
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9100B-030EG
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Component
A viscosity
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25℃/S29/0.1rpm
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Pa·s
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2000-5000
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25℃/S29/1rpm
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300-700
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Component
B viscosity
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25℃/S29/0.1rpm
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Pa·s
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500-1000
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25℃/S29/1rpm
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50-200
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Proportion(A/B)
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by
weight
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-
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100：50
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Curing
conditions
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-
|
-
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25℃/12h 或70℃/30min
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Shear
adhesive strength
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Al-Al
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MPa
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≥15
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Hardness
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25℃
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Shore
D
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≥80
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Glass
transition temperature
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DSC,10℃/min
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℃
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≥40
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Tensile
strength
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-
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MPa
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≥40
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