| 產(chǎn)品中心 >> Adhesive industry >> k Used for bonding of small electronic components with wires |
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| 產(chǎn) 品 類 別 |
| Epoxy adhesive at room temperature
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| 產(chǎn) 品 特 點(diǎn) |
| Good temperature resistance, excellent electrical property, high bonding strength
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| 應(yīng) 用 范 圍 |
| Used for bonding and fixing of small electronic components, conductors, etc.
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| 產(chǎn) 品 性 能 |
9100A/B-015
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Properties
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Test
Conditions
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Unit
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Index
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Component
A
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-
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-
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9100A-015
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Component
B
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-
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-
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9100B-015
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Component
A viscosity
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25℃
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mPa·s
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6000-15000
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Component
B viscosity
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25℃
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mPa·s
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100-300
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Proportion(A/B)
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by
weight
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-
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100：100
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Curing
conditions
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-
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-
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90℃/2h+120℃/1h+150℃/3h
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Hardness
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25℃
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Shore
D
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≥80
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Glass transition
temperature
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DSC,10℃/min
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℃
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≥150
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Volume
resistance
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25℃
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Ω·m
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≥1.0×1013
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Dielectric
constant
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1MHz
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-
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4.0±0.3
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Dissipation
factor
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1MHz
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%
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≤1.5
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Electric
strength
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25℃
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MV/m
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≥20.0
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| 點(diǎn)擊數(shù)：330 錄入時間：2020/7/11 【打印此頁】 【關(guān)閉】 |
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