| 產(chǎn)品中心 >> Adhesive industry >> l Used for bonding of various materials with potting of electronic components |
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| 產(chǎn) 品 類 別 |
| Epoxy Resin Compounds for Potting
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| 產(chǎn) 品 特 點(diǎn) |
| Environmental product, good toughness, good adhesion
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| 應(yīng) 用 范 圍 |
| Used for bonding of various materials and potting of electronic components
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| 產(chǎn) 品 性 能 |
6100A/B-52
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Properties
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Test
Conditions
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Unit
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Index
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Component
A
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-
|
-
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6100A-52
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Component
B
|
-
|
-
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6100B-52
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Component
A viscosity
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25℃
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mPa·s
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15000 ～30000
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Component
B viscosity
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25℃
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mPa·s
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50～ 130
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Component
A specific gravity
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25℃
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g/cm3
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1.10 ～1.19
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Component
B specific gravity
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25℃
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g/cm3
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0.96 ～ 1.01
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Proportion(A/B)
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by
weight
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-
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100:33
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Curing
conditions
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-
|
-
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25℃/24H
or 60℃/3H
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Hardness
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25℃
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Shore
D
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50-70
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Volume
resistance
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1MHz
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Ω.m
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≥1.0×1010
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Tensile
strength
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1MHz
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MPa
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>0.9
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Elongation
at break
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25℃
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%
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>150
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Water
absorption
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25℃/24h
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%
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≤0.20
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