| 產(chǎn)品中心 >> Adhesive industry >> m Encapsulation, or fixation of various small electronic components |
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| 產(chǎn) 品 類 別 |
| One-component bound adhesive
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| 產(chǎn) 品 特 點 |
| Reduction, high bonding strength, excellent electrical property
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| 應(yīng) 用 范 圍 |
| Encapsulation, or fixation of various small electronic components
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| 產(chǎn) 品 性 能 |
6087W2
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Properties
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Test
Conditions
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Unit
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Index
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Specific
gravity
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25℃
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g/cm3
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1.40～1.48
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Viscosity
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25℃/1rpm
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Pa·s
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300～600
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Curing
conditions
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-
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-
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110℃/90min
or 120℃/60min
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Length
of sagging
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45º，0.1g
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Mm
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≤15
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Volume
resistance
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Normal
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Ω·cm
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≥1.0×1015
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Electric
strength
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Normal
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kV/mm
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≥20.0
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Dielectric
constant
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1MHz
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-
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4.5～5.1
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Glass
transition temperature
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DSC,10℃/min
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℃
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≥110
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Hardness
(Shore D)
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25℃
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-
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≥80
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Shear
adhesive strength
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Al-Al
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MPa
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≥12
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| 點擊數(shù)：360 錄入時間：2020/7/11 【打印此頁】 【關(guān)閉】 |
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