| 產品中心 >> Adhesive industry >> n Used for sealing, potting with bonding of inductive magnetic materials, coils, etc |
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| 產 品 類 別 |
| One-component bound adhesive
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| 產 品 特 點 |
| High bonding strength, high Tg, low halogen content, high thixotropy
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| 應 用 范 圍 |
| Used for sealing, potting and bonding of inductive magnetic materials, coils, etc.
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| 產 品 性 能 |
6087G1
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Properties
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Test
Conditions
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Unit
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Index
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Specific
gravity
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25℃
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g/cm3
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1.41～1.55
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Viscosity
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25℃/0.1rpm
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Pa·s
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3000～8000
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25℃/1rpm
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Pa·s
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500～1000
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Curing
conditions
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-
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-
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110℃/100min
or 120℃/60min
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Hardness
(Shore D)
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25℃
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Shore
D
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≥85
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Glass
transition temperature
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DSC，10℃/min
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℃
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≥100
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Coefficient
of thermal expansion a1
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TMA，10℃/min
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M/M/K
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≤6.0×10-5
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Shear
adhesive strength
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Al-Al
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MPa
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≥12
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Temperature
Resistance
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200℃
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h
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200
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Volume
resistance
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Normal
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Ω·cm
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≥1.0×1014
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Electric
strength
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Normal
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kV/mm
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≥20.0
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| 點擊數(shù)：248 錄入時間：2020/7/11 【打印此頁】 【關閉】 |
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