| 產(chǎn)品中心 >> Adhesive industry >> i Used for bonding with fixing of small electronic components |
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| 產(chǎn) 品 類 別 |
| Flame retardant Epoxy Resin Compounds for Potting
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| 產(chǎn) 品 特 點 |
| Fast curing speed, high bonding strength, flame retardant, high thixotropy
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| 應 用 范 圍 |
| Used for bonding and fixing of small electronic components
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| 產(chǎn) 品 性 能 |
5201A/B-012B
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Properties
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Test
Conditions
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Unit
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Index
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Component
A
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-
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-
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5201A-012B
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Component
B
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-
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-
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5201B-012B
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Component
A viscosity
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25℃/S29/0.1rpm
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Pa·s
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2000-6000
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25℃/S29/1rpm
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500-1000
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Component
B viscosity
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25℃/S29/0.1rpm
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Pa·s
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2000-6000Pa.s
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25℃/S29/1rpm
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300-800Pa.s
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Component
A specific gravity
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25℃
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g/cm3
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1.34±0.04
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Component
B specific gravity
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25℃
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g/cm3
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1.47±0.04
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Proportion(A/B)
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by
weight
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-
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100：100
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Curing
conditions
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-
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-
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25℃/8-12h
or 70℃/1h
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Hardness
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25℃
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Shore
D
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≥80
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Glass
transition temperature
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DSC,10℃/min
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℃
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≥40
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Tensile
strength
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25℃
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MPa
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≥40
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Shear
adhesive strength
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Al-Al
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MPa
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≥10
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Volume
resistance
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Normal
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Ω·m
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≥1×1011
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Dielectric
constant
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1MHz，25℃
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-
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4.5±0.3
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Electric
strength
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Normal
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MV/m
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≥18.0
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Flammation
preventable
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UL-94，6mm
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-
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V-0級
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