| 產(chǎn)品中心 >> Adhesive industry >> i Used for bonding with fixing of small electronic components |
| 5201A/B-014B |
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| 產(chǎn) 品 類 別 |
| Epoxy adhesive at room temperature
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| 產(chǎn) 品 特 點(diǎn) |
| Fast curing speed, high bonding strength, excellent electrical property, high thixotropy, good toughness
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| 應(yīng) 用 范 圍 |
| Used for bonding and fixing of small electronic components
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| 產(chǎn) 品 性 能 |
5201A/B-014B
|
Properties
|
Test Conditions
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Unit
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Index
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Component
A
|
-
|
-
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5201A-014B
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|
Component
B
|
-
|
-
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5201B-014B
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Component
A specific gravity
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25℃
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g/cm3
|
1.58±0.04
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Component
B specific gravity
|
25℃
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g/cm3
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1.58±0.04
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Proportion(A/B)
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by
weight
|
-
|
100：100
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Curing
conditions
|
-
|
-
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25℃/12h
or 70℃/60min
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Shear
adhesive strength
|
Al-Al
|
MPa
|
≥10
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Hardness
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25℃
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Shore
D
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≥80
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Glass
transition temperature
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DSC,10℃/min
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℃
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≥40
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Tensile
strength
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-
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MPa
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≥40
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Flammation
preventable
|
UL-94，6mm
|
-
|
V-0級(jí)
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