| 產(chǎn)品中心 >> Adhesive industry >> p.Sealing with coating of small electronic components can also be used for bonding of magnetic cores, coils, metal with engineering plastics electronic components |
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| 產(chǎn) 品 類 別 |
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| 產(chǎn) 品 特 點 |
| Low viscosity, less precipitation, long storage period, good technology, high bonding strength, high resistance to high and low temperature impact
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| 應 用 范 圍 |
| Sealing and coating of small electronic components can also be used for bonding of magnetic cores, coils, metal and engineering plastics electronic components
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| 產(chǎn) 品 性 能 |
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Properties
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Test
Conditions
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Unit
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Index
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Specific
gravity
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25℃
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g/cm3
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1.25～1.45
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Viscosity
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25℃
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mPa·s
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5,000～20,000
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Curing
conditions
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-
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-
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125℃/4h
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Hardness
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Shore
D(25℃)
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-
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≥ 75
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Glass
transition temperature
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TMA
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℃
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80～100
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Inflecting
strength
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25℃
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MPa
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≥ 115
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Inflecting
modulus
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25℃
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MPa
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3000～5000
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Electric
strength
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25℃
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MV/m
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≥ 20
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Volume
resistance
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25℃
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MΩ·m
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≥ 1×106
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Dielectric
constant 30kHz)
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25℃
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-
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3.5～5.5
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Water
absorption
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100℃/1h
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%
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≤ 0.2
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Shear
adhesive strength
(AL/AL)
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25℃
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MPa
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≥ 10
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100℃
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MPa
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≥ 5
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