Properties
|
Test Conditions
|
Unit
|
Index
|
Component A
|
-
|
-
|
6100A-2BH,6100A-2BH-1,6100A-2BH-2
|
Component B
|
-
|
-
|
6100B-2BH,6100B-2BH-1,6100B-2BH-2
|
Component A viscosity
|
90℃
|
mPa·s
|
4000~12000
|
Component B viscosity
|
40℃
|
mPa·s
|
15~25
|
Component A specific gravity
|
25℃
|
g/cm3
|
1.83±0.03
|
Component B specific gravity
|
25℃
|
g/cm3
|
1.20±0.02
|
Proportion(A/B)
|
by weight
|
-
|
100:28
|
Curing
conditions
|
-
|
-
|
85℃/3hr + 105℃/1hr + 135℃/2hr(oven)
75℃/90min + 80℃/45min +90℃/90min + 100℃/45min + 130℃/90min
+
100℃/45min + 80℃/45min (baking
tunnel)
|
Hardness
|
25℃
|
Shore
D
|
≥90
|
Inflecting strength
|
-
|
MPa
|
≥60
|
Glass transition temperature
|
DSC,10℃/min
|
℃
|
≥128
|
Coefficient of thermal
expansion a1
|
TMA,10℃/min
|
m/m/K
|
≤4.2×10-5
|
Coefficient of thermal expansion a2
|
TMA,10℃/min
|
m/m/K
|
≤15.0×10-5
|
Water absorption
|
100℃/30min
|
%
|
≤0.15
|
Cure shrinkage
rate
|
Solid
liquid density ratio
|
%
|
≤2.0
|
Volume
resistance
|
Normal
|
Ω·m
|
≥1.0×1013
|
Dielectric constant
|
1MHz,25℃
|
-
|
4.2±0.3
|
Dissipation factor
|
1MHz,25℃
|
%
|
≤1.5
|
Electric
strength
|
Normal
|
MV/m
|
≥23.0
|