| 產(chǎn)品中心 >> New Energy Automotive Electronics Industry >> a.Used for potting of thin film capacitors HEV/EV controllers with high with low temperature resistance with humīdity resistance |
|
| 產(chǎn) 品 類 別 |
| Flame Retardant Epoxy Resin Compounds for Potting
|
|
| 產(chǎn) 品 特 點(diǎn) |
| Flame retardant, low CTE, low shrinkage, excellent electrical property
|
|
| 應(yīng) 用 范 圍 |
| Used for potting of thin film capacitors HEV/EV controllers with high and low temperature resistance and humidity resistance
|
|
| 產(chǎn) 品 性 能 |
|
Properties
|
Test Conditions
|
Unit
|
Index
|
|
Component A
|
-
|
-
|
5201A-8BD
|
|
Component B
|
-
|
-
|
5201B-8BD
|
|
Component A viscosity
|
40℃
|
mPa·s
|
5000～9000
|
|
Component B viscosity
|
40℃
|
mPa·s
|
500～1500
|
|
Component A specific gravity
|
25℃
|
g/cm3
|
1.75±0.03
|
|
Component B specific gravity
|
25℃
|
g/cm3
|
1.79±0.03
|
|
Proportion(A/B)
|
by weight
|
-
|
100：100
|
|
Curing
conditions
|
-
|
-
|
85℃/3h + 100℃/1h + 135℃/2h① 或 85℃/3h + 105℃/3h②+140℃/2h
|
|
Hardness
|
25℃
|
Shore
D
|
≥88
|
|
Inflecting strength
|
---
|
MPa
|
≥80
|
|
Glass transition temperature
|
DSC，10℃/min
|
℃
|
≥105
|
|
Coefficient of thermal
expansion a1
|
TMA，10℃/min
|
ppm/℃
|
≤27
|
|
Water absorption
|
100℃/30min
|
%
|
≤0.20
|
|
Cure shrinkage rate
|
Solid
liquid density ratio
|
%
|
≤1.8
|
|
Volume resistance
|
Normal
|
Ω·m
|
≥1.0×1013
|
|
Dielectric constant
|
1MHz，25℃
|
-
|
4.5±0.3
|
|
Dissipation factor
|
1MHz，25℃
|
%
|
≤1.5
|
|
Electric strength
|
Normal
|
MV/m
|
≥20.0
|
|
|
|
| 點(diǎn)擊數(shù)：280 錄入時(shí)間：2020/7/11 【打印此頁】 【關(guān)閉】 |
蘇公網(wǎng)安備 32021402001754號(hào)