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 Product Center >> Power Device Industry >> b Used for potting with insulation of power heating electronic components
6100A-41BD/116B-3 or 116 B-7 or 116 B-9
   Category
Thermal conductivity Epoxy Resin Compounds for Potting
   Characteristics
Excellent electrical property, Environmental product, high thermal conductivity
   Scope of application
Used for potting and insulation of power heating electronic components
   Product performance
6100A-41BD/116B-3 or 116 B-7 or 116 B-9

   Properties

   Test Conditions

  Unit

   Index

Component A

-

-

6100A-41BD

Component B

-

-

116B-3,116B-7

116B-9

Component A viscosity

40

mPa·s

20000

Component B viscosity

40

mPa·s

520

Component A specific gravity

25

g/cm3

2.45±0.03

Component B specific gravity

25

g/cm3

0.98±0.03

Proportion(A/B)

by weight

-

100 : 8-10

100 : 10-12.5

Curing conditions

-

-

25/24-48h or 80/2-3h

25/16h or 80/1.5h

Hardness

25

 

85

Inflecting strength

Normal

MPa

80

Glass transition temperature

DSC,10/min

4560

Water absorption

100/30min

%

0.2

Thermal conductivity

Plate heat flow method

W/m·K

1.0

0.9

Volume resistance

Normal

Ω·m

1.0×1012

Dielectric constant

1MHz,25

 

4.5±0.3

Dissipation factor

1MHz,25

%

1.6

Electric strength

Normal

MV/m

20.0

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