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 Product Center >> Power Device Industry >> b Used for potting with insulation of power heating electronic components
6100A-8FT / 116B-3 or 117B-3
   Category
Thermal conductivity Epoxy Resin Compounds for Potting
   Characteristics
Excellent electrical property, high thermal conductivity, Environmental product
   Scope of application
Filling insulation or encapsulation insulation protection for power heating electronic components
   Product performance
6100A-8FT / 116B-3 or  117B-3

   Properties

   Test Conditions

  Unit

   Index

Component A

-

-

6100A-8FT

Component B

-

-

116B-3

117B-3

Component A viscosity

25

Pa·s

200-400

Component B viscosity

40

mPa·s

515

1030

Component A specific gravity

25

g/cm3

2.58±0.05

Component B specific gravity

25

g/cm3

0.97±0.03

0.98±0.03

Proportion(A/B)

by weight

-

100 / 7 ± 0.2

100 / 5.0 - 5.5

Curing conditions

-

-

25/24h 100/1h(or 25/2h + 100/1h

Hardness

25

Shore D

92

90

Tensile strength

25

MPa

75

80

Compression strength

25

MPa

120

120

Glass transition temperature①

DSC,10/Min

4560

70

Glass transition temperature②

DSC10/Min

50

120

Coefficient of thermal expansion  a1

TMA,10/Min

ppm/

26-36

25-35

Coefficient of thermal expansion  a2

TMA10/Min

ppm/

80-120

80-110

Water absorption

25/24h

%

0.2

Volume resistance

Normal

Ω·m

1.0×1013

1.0×1012

Dielectric constant

1MHz,25

 

5.0±0.3

4.8±0.3

Dissipation factor

1MHz,25

%

0.04

0.03

Electric strength

Normal

MV/m

18.0

Thermal conductivity

Normal

W/m·K

1.1

1.2

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