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 Product Center >> Power Device Industry >> c Used for potting with insulation of bridge ballast, rectifier diode or other heating electronic components
6100A/B-8BG
   Category
Epoxy Resin Compounds for Potting
   Characteristics
Excellent electrical property, Environmental product,low CTE, low curing shrinkage, low stress
   Scope of application
Used for potting and insulation of bridge ballast, rectifier diode or other heating electronic components
   Product performance
6100A/B-8BG

   Properties

   Test Conditions

  Unit

   Index

Component A

-

-

6100A-8BG

Component B

-

-

6100B-8BG

Component A viscosity

40

mPa·s

100,000

Component B viscosity

40

mPa·s

1530

Component A specific gravity

25

g/cm3

1.77±0.05

Component B specific gravity

25

g/cm3

1.19±0.05

Proportion(A/B)

by weight

-

10024-25

Curing conditions

-

-

80/2h +100/2h+140/2h

Glass transition temperature

DSC

120

Volume resistance

Normal

Ω·m

1.0×1013

Dielectric constant

1MHz

 

4.6±0.3

Dissipation factor

1MHz

%

1.5

Electric strength

Normal

MV/m

20

Inflecting strength

Normal

MPa

75

Hardness(Shore D)

Normal

 

90

Coefficient of thermal expansion  a1

TMA

1/

3.5×10-5

Coefficient of thermal expansion  a2

TMA

1/

13.0×10-5

Thermal conductivity

Normal

W/m·k

O.4

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