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 Product Center >> Power Device Industry >> i Used for potting with insulation of various electronic components with good temperature resistance, moisture resistance with heat resistance requirements with power type
5201A/B-68BD
   Category
Flame retardant Epoxy Resin Compounds for Potting
   Characteristics
Flame retardant, low CTE, low shrinkage, excellent electrical property
   Scope of application
Used for potting and insulation of various electronic components with good temperature resistance, moisture resistance and heat resistance requirements and power type
   Product performance
5201A/B-68BD

   Properties

   Test Conditions

  Unit

   Index

Component A

-

-

5201A-68BD

Component B

-

-

5201B-68BD

Component A viscosity

40

mPa·s

2000040000

Component B viscosity

40

mPa·s

10003000

Component A specific gravity

25

g/cm3

1.79±0.03

Component B specific gravity

25

g/cm3

1.81±0.03

Proportion(A/B)

by weight

-

100100

Curing conditions

-

-

90/2h + 110/1h + 140/2h or 100/1.5h + 150/1.5h/1.5h + 150/1.5h+ 105/3h+140/2h

Hardness

25

-

88

Inflecting strength

-

MPa

70

Cure shrinkage rate

Solid-liquid density ratio

%

1.8

Glass transition temperature

DSC,10/min

155

Coefficient of thermal expansion  a1

TMA10/min

m/m/K

2.5×10-5

Water absorption

100/30min

%

0.20

Volume resistance

Normal

Ω·m

1.0×1013

Dielectric constant

1MHz25

-

4.5±0.3

Dissipation factor

1MHz25

%

1.5

Electric strength

Normal

MV/m

22.0

Flammation Preventable

UL 946mm

-

V-0

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