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 Product Center >> Adhesive industry >> k Used for bonding of small electronic components with wires
9100A/B-052
   Category
Epoxy adhesive at room temperature adhesive
   Characteristics
Fast curing speed, excellent electrical property, high bonding strength
   Scope of application
Used for bonding of small electronic components and wires
   Product performance
9100A/B-052

Properties

Test Conditions

Unit

Index

Component A

-

-

9100A-052

Component B

-

-

9100B-052

Component A viscosity

25℃

mPa·s

8000-16000

Component B viscosity

25℃

mPa·s

10000-30000

Proportion(A/B)

by weight

-

100100

Curing conditions

-

-

Normal

Shear adhesive strength

Al-Al

MPa

≥3

Hardness

25℃

Shore D

≥70

Glass transition temperature

DSC,10℃/min

≥40

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