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9100A/B-012
   Category
Epoxy adhesive at room temperature
   Characteristics
Fast curing, excellent electrical property, high bonding strength, high thixotropy
   Scope of application
Used for bonding and fixing of small electronic components
   Product performance
9100A/B-012

Properties

Test Conditions

Unit

Index

Component A

-

-

9100A-012

Component B

-

-

9100B-012

Component A viscosity

25℃

mPa·s

50000-100000

Component B viscosity

25℃

mPa·s

50000-100000

Proportion(A/B)

by weight

-

100100

Curing conditions

-

-

25℃/8-12h  or 70℃/1h

Hardness

25℃

Shore D

≥80

Tensile strength

25℃

MPa

≥40

Shear adhesive strength

Al-Al

MPa

≥10

Glass transition temperature

DSC,10℃/min

≥40

Volume resistance

25℃

Ω·m

≥1×1011

Dielectric constant

1MHz

-

4.5±0.3

Electric strength

25℃

MV/m

≥18.0

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