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9100A/B-030EG
   Category
Epoxy adhesive at room temperature
   Characteristics
Fast curing speed, high thixotropy, excellent electrical property, high bonding strength
   Scope of application
Used for bonding and fixing of small electronic components
   Product performance
9100A/B-030EG

Properties

Test Conditions

Unit

Index

Component A

-

-

9100A-030EG

Component B

-

-

9100B-030EG

Component A viscosity

25℃/S29/0.1rpm

Pa·s

2000-5000

25℃/S29/1rpm

300-700

Component B viscosity

25℃/S29/0.1rpm

Pa·s

500-1000

25℃/S29/1rpm

50-200

Proportion(A/B)

by weight

-

10050

Curing conditions

-

-

25℃/12h 70℃/30min

Shear adhesive strength

Al-Al

MPa

≥15

Hardness

25℃

Shore D

≥80

Glass transition temperature

DSC,10℃/min

≥40

Tensile strength

-

MPa

≥40

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