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 Product Center >> Small Electronic Components Industry >> a.Encapsulation or fixation of various small electronic components
6100A-32BT/116B-9 or 116 B-91 or 116 B-92
  
   Category
Epoxy Resin Compounds for Potting at room temperature
   Characteristics
High-touch, hypoallergenic, low viscosity, good technology, good electrical property, environmental product
   Scope of application
Encapsulation or fixation of various small electronic components
   Product performance
6100A-32BT/116B-9 or 116 B-91 or 116 B-92

Properties

Test Conditions

Unit

Index

Component A

-

-

6100A-32BT

Component B

-

-

116B-9

116B-91

116B-92

Component A viscosity

25

mPa·s

3500060000

Component B viscosity

25

mPa·s

120300

120240

100180

Component A specific gravity

25

g/cm3

1.60±0.05

Component B specific gravity

25

g/cm3

1.01±0.05

1.00±0.05

1.00±0.05

Proportion(A/B)

by weight

-

10020-25

10020

10020

Curing conditions

-

-

25/24 h

25/36h

25/30h

Hardness

25

Shore-D

82

80

80

Water absorption

Normal 30h

%

0.20

0.25

0.25

Volume resistance

Normal

Ω·m

1×1012

Electric strength

Normal

MV/m

20

Dielectric constant

1MHz,25

3.64.2

3.84.4

3.84.4

Dissipation factor

1MHz25

%

1.6

1.8

1.8

High and low temperature resistance

170/168h and -40/168h

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