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 Product Center >> Small Electronic Components Industry >> d.Used for filling insulation of electronic components with low stress requirements
6100A/B-5BD
   Category
Tough packer epoxy Resin Compounds for Potting
   Characteristics
Environmental product, low shrinkage, low stress, good resistance to heat impact, good electrical property
   Scope of application
Used for filling insulation of electronic components with low stress requirements
   Product performance

   Properties

   Test Conditions

  Unit

   Index

Component A

-

-

6100A-5BD

Component B

-

-

6100B-5BD

Component A viscosity

90

mPa·s

3000-6000

Component B viscosity

40

mPa·s

1530

Component A specific gravity

25

g/cm3

1.71±0.05

Component B specific gravity

25

g/cm3

1.20±0.05

Proportion(A/B)

by weight

-

10025

Curing conditions

-

-

80/2h + 100/2h + 120/2h + 140/2h

Hardness

25

Shore D

92

Inflecting strength

 

MPa

60

Glass transition temperature

DSC,10/min

120

Volume resistance

Normal

Ω·m

1.0×1013

Dielectric constant

1MHz,25

 

4.50

Dissipation factor

1MHz,25

%

1.3

Electric strength

Normal

MV/m

20

Coefficient of thermal expansion  a1

TMA

1/

3.8×10-5

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