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 Product Center >> Small Electronic Components Industry >> a.Encapsulation or fixation of various small electronic components
6100A-31BT/113B-3 or 113 B-7 or 116 B-7 or 116 or 116
   Category
Tough packer epoxy Resin Compounds for Potting
   Characteristics
Mixture molding not flowing, good electrical property, environmental product
   Scope of application
Used for encapsulation, encapsulation or fixation of various small electronic components
   Product performance
                                                                                                       

Properties

Test Conditions

Unit

Index

Component A

-

-

6100A-31BT

Component B

-

-

113B-3

113B-7

116B-3

116B-7

Component A viscosity

40

mPa·s

/

Component B viscosity

40

mPa·s

20-60

5-20

Component A specific gravity

25

g/cm3

1.60±0.05

Component B specific gravity

25

g/cm3

1.13±0.02

0.97±0.02

Proportion(A/B)

by weight

-

10025

10015

Curing conditions

-

-

60/2h24/24-36h

60/3-4h25/36-48h

Hardness

25

ShoreD

82

77

Volume resistance

Normal

Ω·m

1×1012

1×1010

Dielectric constant

1MHz,25

3.94.5

4.35.0

Dissipation factor

1MHz,25

%

1.5

1.8

Electric strength

Normal

MV/m

20

Water absorption

Normal 24h

%

0.2

0.3

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