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 Product Center >> Small Electronic Components Industry >> g.Used for potting with sealing small with medium-sized electronic components 6100A/B-37 Series
6100A/B-37 Series
   Category
Normal or heated Epoxy Resin Compounds for Potting
   Characteristics
Moderate viscosity, good electrical property, excellent mechanical property
   Scope of application
Used for potting and sealing small and medium-sized electronic components
   Product performance


   Properties

   Test Conditions

  Unit

   Index

Component A

-

-

6100A-37N,6100A-37B,6100A-37W

Component B

-

-

6100B-37N,6100B-37B,6100B-37W

Component A viscosity

25

mPa·s

20000100000

Component B viscosity

25

mPa·s

300600

Component A specific gravity

25

g/cm3

1.57±0.03

Component B specific gravity

25

g/cm3

0.99±0.02

Proportion(A/B)

by weight

-

10025 ± 2

Curing conditions

-

-

7580/22.5h 25/48h

Hardness

25

Shore D

80

Inflecting strength

 

MPa

60

Glass transition temperature

DSC,10/min

50

Volume resistance

Normal

Ω·m

1.0×1011

Dielectric constant

1MHz25

 

5.2±0.3

Dissipation factor

1MHz25

%

1.5

Electric strength

Normal

MV/m

20.0

Water absorption

25/24h

%

0.2


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