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 Product Center >> Small Electronic Components Industry >> h.Used for bonding various materials with sealing of electronic components 6100A/B-52B
6100A/B-52B
  
   Category
Normal or heated Epoxy Resin Compounds for Potting
   Characteristics
Moderate viscosity, good flexibility, environmental product, good adhesion
   Scope of application
Used for bonding various materials and sealing of electronic components
   Product performance


Properties

Test Conditions

Unit

Index

Component A

-

-

6100A-52B

Component B

-

-

6100B-52B

Component A viscosity

25

mPa·s

15000 30000

Component B viscosity

25

mPa·s

20 50

Component A specific gravity

25

g/cm3

1.10 1.19

Component B specific gravity

25

g/cm3

0.96 1.01

Proportion(A/B)

by weight

-

100:25

Curing conditions

-

-

25/24H or 60/2H

Hardness

25

Shore A

3060

Volume resistance

1MHz

Ω.m

1.0×1010

Tensile strength

1MHz

MPa

>0.9

Elongation at break

25

%

>150

Water absorption

25/24H

%

0.20


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