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 Product Center >> Small Electronic Components Industry >> a.Encapsulation or fixation of various small electronic components
6100A-1BT /116B-95
   Category
Epoxy Resin Compounds for Potting at room temperature
   Characteristics
High thixotropy, low viscosity, high temperature resistance, good electrical property, environmental product, hypoallergenic
   Scope of application
Used for encapsulation or fixation of various small electronic components
   Product performance


Properties

Test Conditions

Unit

Index

Component A

-

-

6100A-1BT

Component B

-

-

116B-95

Component A viscosity

25

mPa·s

5000090000

Component B viscosity

40

mPa·s

80150

Component A specific gravity

25

g/cm3

1.75±0.05

Component B specific gravity

25

g/cm3

1.05±0.03

Proportion(A/B)

by weight

-

10020

Curing conditions

-

-

25/30h

Hardness

25

Shore-D

80

Water absorption

Normal 30h

%

0.25

Volume resistance

Normal

Ω·m

1×1012

Electric strength

Normal

MV/m

20

Dielectric constant

1MHz,25

3.84.4

Dissipation factor

1MHz,25

%

1.8


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