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 Product Center >> Small Electronic Components Industry >> a.Encapsulation or fixation of various small electronic components
6100A-4BT /113B-7 or 116 B-3
   Category
Normal or heated Epoxy Resin Compounds for Potting
   Characteristics
Mixture forming not flowing, good electrical property, high and low temperature resistance, environmental product,
   Scope of application
Used for encapsulation or fixation of various small electronic components
   Product performance

   Properties

   Test Conditions

  Unit

   Index

Component A

-

-

6100A-4BT

Component B

-

-

113B-7

116B-3

Component A viscosity

40

mPa·s

/

Component B viscosity

40

mPa·s

2040

515

Component A specific gravity

25

g/cm3

1.62±0.05

Component B specific gravity

25

g/cm3

1.13±0.05

0.97±0.05

Proportion(A/B)

by weight

-

10020~25

10015~18

Curing conditions

-

-

60/2h or 25/24h

60/3h or 25/24h

Volume resistance

Normal

Ω·m

1×1011

1×1012

Electric strength

Normal

MV/m

20

Dielectric constant

-

-

4.14.7

3.94.5

Hardness

25

ShoreD

80

Dissipation factor

1MHz

%

1.5

Water absorption

Normal 24h

%

0.2

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