| 產(chǎn)品中心 >> Small Electronic Components Industry >> d.Used for filling insulation of electronic components with low stress requirements |
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| 產(chǎn) 品 類(lèi) 別 |
| Tough packer epoxy Resin Compounds for Potting
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| 產(chǎn) 品 特 點(diǎn) |
| Environmental product, low shrinkage, low stress, good resistance to heat impact, good electrical property
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| 應(yīng) 用 范 圍 |
| Used for filling insulation of electronic components with low stress requirements
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| 產(chǎn) 品 性 能 |
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Properties
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Test Conditions
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Unit
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Index
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Component A
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-
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-
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6100A-5BD
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Component B
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-
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-
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6100B-5BD
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Component A viscosity
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90℃
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mPa·s
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3000-6000
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Component B viscosity
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40℃
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mPa·s
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15～30
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Component A specific gravity
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25℃
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g/cm3
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1.71±0.05
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Component B specific gravity
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25℃
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g/cm3
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1.20±0.05
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Proportion(A/B)
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by weight
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-
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100：25
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Curing
conditions
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-
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-
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80℃/2h + 100℃/2h + 120℃/2h + 140℃/2h
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Hardness
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25℃
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Shore
D
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≥92
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Inflecting strength
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MPa
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≥60
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Glass transition temperature
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DSC，10℃/min
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℃
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≥120
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Volume resistance
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Normal
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Ω·m
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≥1.0×1013
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Dielectric constant
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1MHz，25℃
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≤4.50
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Dissipation factor
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1MHz，25℃
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%
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≤1.3
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Electric strength
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Normal
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MV/m
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≥20
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Coefficient of thermal expansion a1
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TMA
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1/℃
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≤3.8×10-5
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