| 產(chǎn)品中心 >> Small Electronic Components Industry >> a.Encapsulation or fixation of various small electronic components |
| 6100A-31BT/113B-3 or 113 B-7 or 116 B-7 or 116 or 116 |
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| 產(chǎn) 品 類 別 |
| Tough packer epoxy Resin Compounds for Potting
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| 產(chǎn) 品 特 點(diǎn) |
| Mixture molding not flowing, good electrical property, environmental product
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| 應(yīng) 用 范 圍 |
| Used for encapsulation, encapsulation or fixation of various small electronic components
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| 產(chǎn) 品 性 能 |
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Properties
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Test Conditions
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Unit
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Index
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Component A
|
-
|
-
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6100A-31BT
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Component B
|
-
|
-
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113B-3
|
113B-7
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116B-3
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116B-7
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Component A viscosity
|
40℃
|
mPa·s
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/
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Component B viscosity
|
40℃
|
mPa·s
|
20-60
|
5-20
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|
Component A specific gravity
|
25℃
|
g/cm3
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1.60±0.05
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|
Component B specific gravity
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25℃
|
g/cm3
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1.13±0.02
|
0.97±0.02
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Proportion(A/B)
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by weight
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-
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100：25
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100：15
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Curing
conditions
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-
|
-
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60℃/2h或24℃/24-36h
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60℃/3-4h或25℃/36-48h
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Hardness
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25℃
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ShoreD
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≥82
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≥77
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Volume
resistance
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Normal
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Ω·m
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≥1×1012
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≥1×1010
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Dielectric constant
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1MHz，25℃
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3.9～4.5
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4.3～5.0
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Dissipation factor
|
1MHz，25℃
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%
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≤1.5
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≤1.8
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Electric strength
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Normal
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MV/m
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≥20
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Water absorption
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Normal 24h
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%
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≤0.2
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≤0.3
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