| 產(chǎn)品中心 >> Small Electronic Components Industry >> e.Used for potting of electronic components with various flexibility requirements |
|
| 產(chǎn) 品 類 別 |
| Normal or heated Epoxy Resin Compounds for Potting
|
|
| 產(chǎn) 品 特 點(diǎn) |
| Good flexibility,good resistance to cold and heat impact, good electrical property, environmental product
|
|
| 應(yīng) 用 范 圍 |
| Used for potting of electronic components with various flexibility requirements
|
|
| 產(chǎn) 品 性 能 |
|
Properties
|
Test Conditions
|
Unit
|
Index
|
|
Component A
|
-
|
-
|
6100A-57B
|
|
Component B
|
-
|
-
|
6100B-57B
|
|
Component A viscosity
|
25℃
|
mPa·s
|
4,000～7,000
|
|
Component B viscosity
|
25℃
|
mPa·s
|
3000～6000
|
|
Component A specific gravity
|
25℃
|
g/cm3
|
1.15±0.03
|
|
Component B specific gravity
|
25℃
|
g/cm3
|
1.03±0.03
|
|
Proportion(A/B)
|
by weight
|
-
|
100：80+10
|
|
Curing
conditions
|
-
|
-
|
60℃/1-2h 或 25℃/12-24h
|
|
Hardness
|
25℃
|
Shore
D
|
50～75
|
|
Volume resistance
|
Normal
|
Ω·m
|
≥1.0×1011
|
|
Electric strength
|
Normal
|
MV/m
|
≥20.0
|
|
Dielectric constant
|
1MHz，25℃
|
|
4.6～5.2
|
|
Water absorption
|
Normal 24h
|
%
|
≤0.30
|
|
|
|
| 點(diǎn)擊數(shù)：344 錄入時(shí)間：2020/7/11 【打印此頁(yè)】 【關(guān)閉】 |
蘇公網(wǎng)安備 32021402001754號(hào)