| 產(chǎn)品中心 >> Small Electronic Components Industry >> g.Used for potting with sealing small with medium-sized electronic components 6100A/B-37 Series |
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| 產(chǎn) 品 類 別 |
| Normal or heated Epoxy Resin Compounds for Potting
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| 產(chǎn) 品 特 點(diǎn) |
| Moderate viscosity, good electrical property, excellent mechanical property
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| 應(yīng) 用 范 圍 |
| Used for potting and sealing small and medium-sized electronic components
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| 產(chǎn) 品 性 能 |
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Properties
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Test Conditions
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Unit
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Index
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Component A
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-
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-
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6100A-37N,6100A-37B,6100A-37W
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Component B
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-
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-
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6100B-37N,6100B-37B,6100B-37W
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Component A viscosity
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25℃
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mPa·s
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20000～100000
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Component B viscosity
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25℃
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mPa·s
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300～600
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Component A specific gravity
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25℃
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g/cm3
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1.57±0.03
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Component B specific gravity
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25℃
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g/cm3
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0.99±0.02
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Proportion(A/B)
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by weight
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-
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100：25 ± 2
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Curing
conditions
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-
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-
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75～80℃/2～2.5h 或 25℃/48h
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Hardness
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25℃
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Shore
D
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≥80
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Inflecting strength
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MPa
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≥60
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Glass transition temperature
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DSC，10℃/min
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℃
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≥50
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Volume resistance
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Normal
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Ω·m
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≥1.0×1011
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Dielectric constant
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1MHz，25℃
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5.2±0.3
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Dissipation factor
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1MHz，25℃
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%
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≤1.5
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Electric strength
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Normal
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MV/m
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≥20.0
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Water absorption
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25℃/24h
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%
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≤0.2
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