| 產品中心 >> Small Electronic Components Industry >> h.Used for bonding various materials with sealing of electronic components 6100A/B-52B |
| 6100A/B-52B |
|
|
| 產 品 類 別 |
| Normal or heated Epoxy Resin Compounds for Potting
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|
| 產 品 特 點 |
| Moderate viscosity, good flexibility, environmental product, good adhesion
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| 應 用 范 圍 |
| Used for bonding various materials and sealing of electronic components
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| 產 品 性 能 |
|
Properties
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Test Conditions
|
Unit
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Index
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Component A
|
-
|
-
|
6100A-52B
|
|
Component B
|
-
|
-
|
6100B-52B
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Component A viscosity
|
25℃
|
mPa·s
|
15000～ 30000
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|
Component B viscosity
|
25℃
|
mPa·s
|
20 ～ 50
|
|
Component A specific gravity
|
25℃
|
g/cm3
|
1.10～ 1.19
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|
Component B specific gravity
|
25℃
|
g/cm3
|
0.96 ～1.01
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|
Proportion(A/B)
|
by weight
|
-
|
100:25
|
|
Curing
conditions
|
-
|
-
|
25℃/24H or 60℃/2H
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|
Hardness
|
25℃
|
Shore
A
|
30～60
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|
Volume resistance
|
1MHz
|
Ω.m
|
≥1.0×1010
|
|
Tensile
strength
|
1MHz
|
MPa
|
>0.9
|
|
Elongation
at break
|
25℃
|
%
|
>150
|
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Water absorption
|
25℃/24H
|
%
|
≤0.20
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| 點擊數(shù)：331 錄入時間：2020/7/11 【打印此頁】 【關閉】 |
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