| 產(chǎn)品中心 >> Small Electronic Components Industry >> a.Encapsulation or fixation of various small electronic components |
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| 產(chǎn) 品 類 別 |
| Epoxy Resin Compounds for Potting at room temperature
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| 產(chǎn) 品 特 點 |
| High thixotropy, low viscosity, high temperature resistance, good electrical property, environmental product, hypoallergenic
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| 應(yīng) 用 范 圍 |
| Used for encapsulation or fixation of various small electronic components
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| 產(chǎn) 品 性 能 |
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Properties
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Test Conditions
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Unit
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Index
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Component A
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-
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-
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6100A-1BT
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Component B
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-
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-
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116B-95
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Component A viscosity
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25℃
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mPa·s
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50000～90000
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Component B viscosity
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40℃
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mPa·s
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80～150
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Component A specific gravity
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25℃
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g/cm3
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1.75±0.05
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Component B specific gravity
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25℃
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g/cm3
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1.05±0.03
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Proportion(A/B)
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by weight
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-
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100：20
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Curing conditions
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-
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-
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25℃/30h
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Hardness
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25℃
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Shore-D
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≥80
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Water absorption
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Normal 30h
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%
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≤0.25
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Volume
resistance
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Normal
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Ω·m
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≥1×1012
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Electric
strength
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Normal
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MV/m
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≥20
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Dielectric constant
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1MHz，25℃
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～
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3.8～4.4
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Dissipation factor
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1MHz，25℃
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%
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≤1.8
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| 點擊數(shù)：343 錄入時間：2020/7/11 【打印此頁】 【關(guān)閉】 |
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