| 產(chǎn)品中心 >> Small Electronic Components Industry >> a.Encapsulation or fixation of various small electronic components |
| 6100A-4BT /113B-7 or 116 B-3 |
|
| 產(chǎn) 品 類 別 |
| Normal or heated Epoxy Resin Compounds for Potting
|
|
| 產(chǎn) 品 特 點 |
| Mixture forming not flowing, good electrical property, high and low temperature resistance, environmental product,
|
|
| 應(yīng) 用 范 圍 |
| Used for encapsulation or fixation of various small electronic components
|
|
| 產(chǎn) 品 性 能 |
|
Properties
|
Test Conditions
|
Unit
|
Index
|
|
Component A
|
-
|
-
|
6100A-4BT
|
|
Component B
|
-
|
-
|
113B-7
|
116B-3
|
|
Component A viscosity
|
40℃
|
mPa·s
|
/
|
|
Component B viscosity
|
40℃
|
mPa·s
|
20～40
|
5～15
|
|
Component A specific gravity
|
25℃
|
g/cm3
|
1.62±0.05
|
|
Component B specific gravity
|
25℃
|
g/cm3
|
1.13±0.05
|
0.97±0.05
|
|
Proportion(A/B)
|
by weight
|
-
|
100：20~25
|
100：15~18
|
|
Curing
conditions
|
-
|
-
|
60℃/2h or 25℃/24h
|
60℃/3h or 25℃/24h
|
|
Volume resistance
|
Normal
|
Ω·m
|
≥1×1011
|
≥1×1012
|
|
Electric strength
|
Normal
|
MV/m
|
≥20
|
|
Dielectric constant
|
-
|
-
|
4.1～4.7
|
3.9～4.5
|
|
Hardness
|
25℃
|
ShoreD
|
≥80
|
|
Dissipation factor
|
1MHz
|
%
|
≤1.5
|
|
Water absorption
|
Normal 24h
|
%
|
≤0.2
|
|
|
|
| 點擊數(shù)：343 錄入時間：2020/7/11 【打印此頁】 【關(guān)閉】 |
蘇公網(wǎng)安備 32021402001754號