| 產(chǎn)品中心 >> Small Electronic Components Industry >> a.Encapsulation or fixation of various small electronic components |
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| 產(chǎn) 品 類 別 |
| Epoxy Resin Compounds for Potting
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| 產(chǎn) 品 特 點(diǎn) |
| Solvent-free, high and low temperature resistance, good electrical properties, good moisture resistance, environmental product, flame retardant
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| 應(yīng) 用 范 圍 |
| Used for encapsulation of various small electronic components
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| 產(chǎn) 品 性 能 |
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Properties
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Test Conditions
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Unit
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Index
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Component A
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-
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-
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5201A-2G
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Component B
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-
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-
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5201B-23B
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Component A viscosity
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40℃
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mPa·s
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10000～15000
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Component B viscosity
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40℃
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mPa·s
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5～20
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Component A specific gravity
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25℃
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g/cm3
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1.74±0.05
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Component B specific gravity
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25℃
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g/cm3
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0.96±0.03
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Proportion(A/B)
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by weight
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-
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100：9（8-10）
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Curing
conditions
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-
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-
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80℃/3h or 60℃/5h or 25℃/24h
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Hardness
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（Shore D）
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25℃
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≥80
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Glass transition temperature
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DSC，10℃/min
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℃
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≥80
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Water absorption
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Normal 24h
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%
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≤0.30
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Volume resistance
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Normal
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Ω·m
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≥1.0×1012
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Dielectric constant
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1MHz，25℃
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—
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4.30±0.30
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Electric strength
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Normal
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MV/m
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≥20.0
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Flammation Preventable（6.0mm）
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（UL94）
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-
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V-0
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