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6087W2
   Category
One-component bound adhesive
   Characteristics
Reduction, high bonding strength, excellent electrical property
   Scope of application
Encapsulation, or fixation of various small electronic components
   Product performance
6087W2                                                                     

Properties

Test Conditions

Unit

Index

Specific gravity

25℃

g/cm3

1.401.48

Viscosity

25℃/1rpm

Pa·s

300600

Curing conditions

-

-

110℃/90min or 120℃/60min

Length of sagging

45º0.1g

Mm

≤15

Volume resistance

Normal

Ω·cm

≥1.0×1015

Electric strength

Normal

kV/mm

≥20.0

Dielectric constant

1MHz

-

4.55.1

Glass transition temperature

DSC,10℃/min

≥110

Hardness (Shore D)

25℃

-

≥80

Shear adhesive strength

Al-Al

MPa

≥12

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