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 Product Center >> Small Electronic Components Industry >> e.Used for potting of electronic components with various flexibility requirements
6100A/B-57B
   Category
Normal or heated Epoxy Resin Compounds for Potting
   Characteristics
Good flexibility,good resistance to cold and heat impact, good electrical property, environmental product
   Scope of application
Used for potting of electronic components with various flexibility requirements
   Product performance

Properties

Test Conditions

Unit

Index

Component A

-

-

6100A-57B

Component B

-

-

6100B-57B

Component A viscosity

25

mPa·s

4,0007,000

Component B viscosity

25

mPa·s

30006000

Component A specific gravity

25

g/cm3

1.15±0.03

Component B specific gravity

25

g/cm3

1.03±0.03

Proportion(A/B)

by weight

-

10080+10

Curing conditions

-

-

60/1-2h 25/12-24h

Hardness

25

Shore D

5075

Volume resistance

Normal

Ω·m

1.0×1011

Electric strength

Normal

MV/m

20.0

Dielectric constant

1MHz25

4.65.2

Water absorption

Normal 24h

%

0.30

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